ICT Testing Machine

Let's continue to learn about three other testing methods: ICT Testing, Functional Testing, and X-RAY Inspection.

1. ICT Testing is typically used on mass-produced models with large production volumes. It offers high testing efficiency but comes with significant manufacturing costs. Each type of circuit board requires custom-made fixtures, and the lifespan of each set of fixtures is not very long, making the testing cost relatively high. The testing principle is similar to flying probe testing, which also measures the resistance between two fixed points to determine if there are any short circuits, open soldering, or wrong component issues on the circuit. The image above is of an ICT testing machine.

2. Functional Testing is usually applied to more complex circuit boards. The boards to be tested must be fully soldered and then placed in a specific fixture that simulates the actual usage scenario of the circuit board. Once the power is connected, the functionality of the circuit board is observed to determine if it operates normally. This testing method can accurately determine if the circuit board is functioning correctly. However, it also suffers from low testing efficiency and high testing costs.

3. X-RAY Inspection is necessary for the first article inspection of circuit boards that have BGA-packaged components. X-rays have strong penetrating power and are one of the earliest instruments used for various inspection purposes. The X-ray radio graph can display the thickness, shape, and quality of the solder joints, as well as the solder density. These specific indicators can fully reflect the quality of the solder joints, including open circuits, short circuits, voids, internal bubbles, and insufficient solder amount, and can be quantitatively analyzed.

All the above content is the introduction to the testing methods of the SMT process. If you also want to have a PCBA product like the one shown in the image, please contact our sales staff to place an order.